Intel Splitting Its HEDT Platform Between Z399 Chipset and X599 Chipset

It’s not a secret that Intel is facing a tough time with AMD Ryzen CPUs and AMD has even dominated the HEDT market with its Ryzen Threadripper CPUs. However, Intel is preparing to tackle the Ryzen Threadripper in the HEDT sector but, is also splitting its HEDT platform between Z399 Chipset and X599 chipset.

According to the report, the Intel Z399 chipset will be powering the LGA2066 socket while the Intel X599 chipset will be powering the LGA3647 socket. This move from Intel is probably to counter AMD’s 32 Core and 24 Core Ryzen Threadripper processors that took the HEDT market by storm.

As noted by Techpowerup the Intel X599 chipset could be a competitor in the 24-core, 26-core, and 28-core CPU market while the Intel Z399 chipset could compete with AMD with its 20-core and 22-core processors. Not only that, the existing Skylake-X LCC and HCC chips could be compatible with Intel Z399 chipset.

Speaking of Intel, the company was supposed to bring its 10 nm processors by 2019. However, time and time again Intel has delayed its 10 nm chips as Intel is still struggling with it. But still, Intel claims that it is leading with its 10 nm CPU technology.

Intel CPUs based on the 10 nm process nodes were supposed to drop in the second half of 2019 but now it has been delayed to 2020. Intel is sticking with its 14 nm process node for its upcoming processors as a result.

While Intel is struggling with its 10 nm process node AMD, on the other hand, is preparing its 7 nm CPUs for 2018. According to AMD CEO Lisa Su, AMD has started sampling its 7 nm CPUs and GPUs with select customers in the second quarter of its fiscal year and these 7 nm AMD chips will be in the market by the end of 2018.

She noted that the company has also started to sample its 7nm EPYC server CPU codenamed “Rome” with its select partners and will be available in 2019.

Source: Techpowerup