Samsung announced today that is has started mass producing the next iteration of its 8GB High Memory Bandwidth Memory-2 (HBM2) memory transfer solution ‘Samsung Aquabolt HBM2’.
The successor to the groundbreaking first generation ‘Flarebolt’, the Samsung Aquabolt HBM2 will deliver a whopping 2.4 gigabits per second (Gbps) of memory per pin, making it the industry’s fastest DRAM performance and paving the way for even faster calculations on the latest supercomputers, AI solutions and enabling even more powerful graphics cards to come out on the market.
The 8GB Samsung Aquabolt HBM2 will also provide a massive 307 Gbps bandwidth, allowing it to achieve over 9.6 times the data transfer of its 8GB GDDR5 counterpart.
Using four packages of Aquabolt, the DRAM solution can achieve data transmissions at an unprecedented 1.2 terabytes per second.
Samsung has also added improvements to the overall structure and design, increasing the thermal bumps between HBM2 dies, for better cooling and adding a new protective layer at the back for increased structural integrity.
Samsung’s executive vice president Jaesoo Han had this to say about the release, “We will continue to reinforce our command of the DRAM market by assuring a stable supply of HBM2 worldwide, in accordance with the timing of anticipated next-generation system launches by our customers”.
Asserting Samsung’s new found dominance and position in the fast-paced DRAM market with its first generation ‘Flarebolt’ HBM2 already being used in many current and upcoming AMD graphics cards has resulted in Samsung overtaking Intel’s top position in semiconductor revenue after over 24 years.
To achieve these technical advances in the Samsung Aquabolt HBM2, Samsung had to revamp the TSV design, vertically connecting over 5000 TSVs per die and upgrading the thermal control, allowing for a massive bump in chip performance.
In related news, there are already rumors making rounds on the internet suggesting that Samsung will reveal its next entry in its flagship mobile series the Samsung Galaxy S9 which will have almost no chin at all.
What do you think of Samsung’s newfound lead in the DRAM market? Will they be able to keep it up or Intel take back its place. Let us know.